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PC412S0NIP0F series 1 sheet no.: d2-a08602en date sep. 1. 2006 ? sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of con rmation by device speci cation sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device speci cation sheets before using any sharp device. PC412S0NIP0F series high speed 25mb/s, high cmr mini- at package ? opic photocoupler description PC412S0NIP0F series contains a led optically cou- pled to an opic. it is packaged in a 8 pin mini- at. input-output isolation voltage(rms) is 3.75 kv. high speed response (typ. 25 mb/s) and cmr is min. 20 kv/ s. features 1. 8 pin mini- at package 2. double transfer mold package (ideal for flow soldering) 3. high noise immunity due to high instantaneous common mode rejection voltage (cm h : min. 20 kv/ s, cm l : min. ? 20 kv/ s ) 4. high speed response (t phl : typ. 23 ns, t plh : typ. 22 ns) 5. isolation voltage between input and output (v iso(rms) : 3.75 kv) 6. lead-free and rohs driective compliant agency approvals/compliance 1. recognized by ul1577 (double protection isolation), le no. e64380 (as model no. pc412s ) 2. approved by vde, din en60747-5-2 ( ? ) (as an option), le no. 40009162 (as model no. pc412s ) 3. package resin : ul ammability grade (94v-0)) ( ? ) din en60747-5-2 : successor standard of din vde0884. applications 1. programmable controller 2. inverter * "opic"(optical ic) is a trademark of the sharp corporation. an opic consists of a light-detecting element and a signal- processing circuit integrated onto a single chip.
2 sheet no.: d2-a08602en PC412S0NIP0F series 3.937 0.127 5.994 0.203 1.27 0.05 0.406 0.076 4 8 7 6 5 primary side mark date code rank mark pc412s sharp mark "s" 5.080 0.127 3.175 0.127 0.200 0.025 0.203 0.102 0.305 min. 123 3.937 0.127 5.994 0.203 1.27 0.05 0.406 0.076 4 vde identification mark 8 7 6 5 primary side mark date code rank mark pc412s 4 sharp mark "s" 5.080 0.127 3.175 0.127 0.200 0.025 0.203 0.102 0.305 min. 123 q internal connection diagram q outline dimensions 1. mini- at package [ex. PC412S0NIP0F ]2. mini- at package (vde option) [ex. pc412s0yip0f ] (unit : mm) product mass : approx. 0.15g product mass : approx. 0.15g ? pin and are not allowed external connection v cc1 v in nc ? gnd1 gnd2 v o nc 1 1 2 4 3 8 7 5 6 2 3 ? 3 7 4 5 6 7 v cc2 8 amp. q truth table input led output lonl h off h l : logic (0) h : logic (1) plating material : pd (au ush)
3 sheet no.: d2-a08602en PC412S0NIP0F series repeats in a 20 year cycle 1st digit 2nd digit year of production month of production a.d. mark a.d. mark month mark 1990 a 2002 p january 1 1991 b 2003 r february 2 1992 c 2004 s march 3 1993 d 2005 t april 4 1994 e 2006 u may 5 1995 f 2007 v june 6 1996 h 2008 w july 7 1997 j 2009 x august 8 1998 k 2010 a september 9 1999 l 2011 b october o 2000 m 2012 c november n 2001 n : : december d date code (2 digit) country of origin japan rank mark with or without.
4 sheet no.: d2-a08602en PC412S0NIP0F series (unless otherwise speci ed t a = t opr ) parameter symbol rating unit input supply voltage v cc1 0 to 5.5 v input voltage v in ? + 0.5 v output supply voltage v cc2 0 to 5.5 v high level output voltage v o ? + 0.5 v low level output current i o 10 ma *1 isolation voltage v iso (rms) 3.75 kv operating temperature t opr ? + 85 ? ? + 125 ? ? = 60hz *2 for 10s absolute maximum ratings electro-optical characteristics (unless otherwise speci ed t a = t opr , typ. at t a = 25 ? c, v cc1 = v cc2 = 5v) parameter symbol condition min. typ. max. unit input low level supply current i cc1l v in =0 ? ? ? ? ? ? = ? = 5v 4.4 5.0 ? = ? = 5v 4.0 4.8 ? = 20 = 0 ? 0 0.1 v i o = 400 = 0 ?? = 4ma, v in = 0 ? ? ? = 0, f = 1mhz ? ? = 15pf, cmos logic level v in = 0 = t f <1ns pulse width 40ns duty 50% ? ? ?? ?? ?? ? ? ? ? ? ? ? ? ? ? ? ?
5 sheet no.: d2-a08602en PC412S0NIP0F series model line-up please contact a local sharp sales representative to inquire about production status. package taping 1 500pcs/reel din en60747-5-2 ? PC412S0NIP0F pc412s0yip0f
6 sheet no.: d2-a08602en PC412S0NIP0F series fig.1 test circuit for propagation delay time and rise time, fall time fig.2 test circuit for instantaneous common mode rejection voltage fig.3 output voltage vs. input voltage output voltage (v) input voltage v in (v) 0 012345 1 2 3 4 5 v cc1 = v cc2 = 5v t a = 85 ? c t a = ? ? c t a = 25 ? c input threshould voltage v ith (v) input supply voltage v cci (v) 1 1.1 1.2 1.3 1.4 1.5 1.6 4.5 4.75 5 5.25 5.5 t a = ? ? c t a = 25 ? c t a = 85 ? c v cc1 = v cc2 = 5v v o = 2.5v 1 2 3 4 8 7 6 5 amp. 0.1 f 0.1 f t r = t f <1ns pulse width 40ns duty 50% t plh t r t f t phl 0 5v input 90% 5v cmos 50% 10% v oh v ol 2.5v cmos v in output v out v o c l v cc2 = 5v v cc1 = 5v 1 2 3 4 8 7 6 5 amp. 0.1 f 0.1 f 1kv gnd gnd v cm cm h ,v o cm l ,v o sw at a, v in = 5v sw a b sw at b, v in = 0v v oh v cm v ol v cc2 0.8 + ? 0.8v v o c l v cc2 = 5v v cc1 = 5v fig.4 input threshold voltage vs. input supply voltage
7 sheet no.: d2-a08602en PC412S0NIP0F series fig.5 input high level supply current vs. ambient temperature fig.6 input low level supply current vs. ambient temperature fig.7 output high level supply current vs. ambient temperature fig.8 output low level supply current vs. ambient temperature input high level supply current l ccil (ma) ambient temperature t a (c) 0 0.5 1 1.5 2 2.5 3 ? ? = 5v v in = 5v input low level supply current l ccil (ma) ambient temperature t a (c) 0 2 4 6 8 10 ? ? = 5v v in = 0v output high level supply current l ccil (ma) ambient temperature t a (c) 0 1 2 3 4 5 ? ? = v cc2 = 5v v in = 5v output low level supply current l ccil (ma) ambient temperature t a (c) 0 0.5 1 1.5 2 2.5 3 ? ? = v cc2 = 5v v in = 0v high level output voltage v oh (v) ambient temperature t a (c) 4 4.2 4.4 4.6 4.8 5 5.2 ? ? = v cc2 = 5v v in = 5v i o = ? = ? ? ? = v cc2 = 5v v in = 0v i o = 4ma i o = 400 = 20 fig.9 high level output voltage vs. ambient temperature fig.10 low level output voltage vs. ambient temperature
8 sheet no.: d2-a08602en PC412S0NIP0F series fig.11 rise time/fall time vs. ambient temperature fig.12 propagation delay time vs. ambient temperature fig.13 pulse width distortion vs. ambient temperature fig.14 propagation delay time vs. output load capacitance fig.15 pulse width distortion vs. output lood capacitance risetime tr / fall time tf (ns) ambient temperature t a (c) 0 1 2 3 4 5 6 ? ? = v cc2 = 5v c l = 15pf propagation delay time t phl /t plh (ns) ambient temperature t a (c) 15 17 19 21 23 25 27 29 ? ? = v cc2 = 5v c l = 15pf t phl t plh pulse width distortion |t phl -t plh | (ns) ambient temperature t a (c) ? ? ? ? = v cc2 = 5v c l = 15pf propagation delay time t phl /t plh (ns) output load capacitance c l (pf) 15 17 19 21 23 25 27 29 15 20 25 30 35 40 45 50 v cc1 = v cc2 = 5v t phl t plh pulse width distortion |t phl -t plh | (ns) output load capacitance c l (pf) 0 1 2 3 4 5 6 15 20 25 30 35 40 45 50 v cc1 = v cc2 = 5v remarks : please be aware that all data in the graph are just for reference and not for guarantee.
9 sheet no.: d2-a08602en PC412S0NIP0F series design considerations recommended operating conditions parameter symbol min. typ. max. unit supply voltage v cc1 4.5 ? ? ? ? ? ? + 70 ? c notes about static electricity transistor of detector side in cmos con guration may be damaged by static electricity due to its minute design. when handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. design guide in order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01 f or more between v cc1 -gnd and v cc2 -gnd near the device. the detector which is used in this device, has parasitic diode between each pins and gnd. there are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below gnd level even for instant. therefore it shall be recommended to design the circuit that electric potential of any pin does not become below gnd level. this product is not designed against irradiation and incorporates non-coherent led. recommended foot print (reference) (unit : mm) 1.27 0.64 1.9 7.49 1.27 1.27
10 sheet no.: d2-a08602en PC412S0NIP0F series manufacturing guidelines soldering method re ow soldering: re ow soldering should follow the temperature pro le shown below. soldering should not exceed the curve of temperature pro le and time. please don't solder more than twice. flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270 ? c and within 10s. preheating is within the bounds of 100 to 150 ? c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400 ? c. please don't solder more than twice. other notice please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 1234 300 200 100 0 0 ( ? c) terminal : 260 ? c peak ( package surface : 250 ? c peak) preheat 150 to 180 ? c, 120s or less reflow 220 ? c or more, 60s or less (min)
11 sheet no.: d2-a08602en PC412S0NIP0F series cleaning instructions solvent cleaning : solvent temperature should be 45 ? c or below. immersion time should be 3 minutes or less. ultrasonic cleaning : the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials : ethyl alcohol, methyl alcohol and isopropyl alcohol. in case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. presence of odc this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) speci c brominated ame retardants such as the pbb and pbde are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde).
12 sheet no.: d2-a08602en PC412S0NIP0F series tape and reel package 1. smt gullwing package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions reel structure and dimensions a c e g f b d dimensions list (unit : mm) a 1.5 c 1.0 d 0.2 e 0.8 f 2.0 typ. g 2.0 0.5 direction of product insertion pull-out direction [packing : 1 500pcs/reel] dimensions list (unit : mm) a 12.0 0.3 b 5.50 0.05 c 1.75 0.10 d 8.0 0.1 e 2.00 0.05 h 5.4 0.1 i 0.30 0.05 j 3.7 0.1 k 6.3 0.1 f 4.0 0.1 g 0.05 k fe i d j h b a c g h 5 ? max.
13 sheet no.: d2-a08602en PC412S0NIP0F series important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the speci cations, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used speci ed in the relevant speci cation sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- of ce automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traf c signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this publication. [e249]

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